SILICON & COMPUTE
Chips & Compute
Accelerators · Clusters · Supply
40 articles
- TSMC's 2nm N2 node hits full ramp as A16 backside power feeds the next AI wave — 2026-10-28
- All three HBM4 suppliers are now in production for NVIDIA's Vera Rubin platform — 2026-10-28
- MediaTek joins NVIDIA's NVLink Fusion to build custom AI accelerators for the cloud — 2026-10-28
- GigaDevice's Hong Kong listing marks a Chinese memory and MCU maker's push into edge AI — 2026-10-28
- SMIC stretches DUV lithography to 7nm and eyes 5nm without EUV — 2026-10-27
- Huawei's Ascend 910C bets on cluster scale over single-chip speed — 2026-10-27
- CXMT races to mass-produce HBM3 and close China's memory gap — 2026-10-27
- UniVista's 3DIC design tool signals China's EDA shift from catch-up to frontier — 2026-10-27
- Sunrise's LPDDR6 inference GPU bets cheaper tokens beat bigger flops — 2026-10-27
- NIO's Shenji NX9031 turns the car chip from cost center to bargaining chip — 2026-10-27
- ChangXin's LPDDR6 mass production puts China on the high-end memory map — 2026-10-27
- Cambricon turns first profit as China's AI chip demand explodes — 2026-10-27
- SICC became the world's top silicon-carbide wafer maker — and lost money doing it — 2026-10-25
- Iluvatar CoreX bet on general-purpose GPUs and just posted 92% revenue growth — 2026-10-25
- One in three Chinese smart cars runs on Horizon Robotics' chips — can it outlast the price war? — 2026-10-25
- Eoptolink wires Google and Amazon's AI data centers — and just filed for a US$5 billion Hong Kong listing — 2026-10-25
- Alibaba's XuanTie ships a server-grade RISC-V core for AI-era compute — 2026-10-24
- VeriSilicon's backlog tops RMB 5B as cloud-AI ASIC orders reshape a design house — 2026-10-24
- Hygon's C86-plus-DCU bet: a self-contained compute stack for Chinese AI — 2026-10-24
- Hua Hong's Wuxi FAB9 ramps as China's No. 2 foundry leans into 12-inch wafers — 2026-10-24
- NAURA's 2024 results show China's broad-line equipment maker is scaling with the fabs — 2026-10-23
- Loongson's 3C6000 server chip bets on a third CPU ecosystem beyond x86 and ARM — 2026-10-23
- Enflame's market debut puts a self-built AI accelerator maker under the spotlight — 2026-10-23
- AMEC's 2024 results and new edge etcher signal a maturing Chinese toolmaker — 2026-10-23
- Can China's homemade lithography finally break ASML's grip? — 2026-10-22
- Who is putting Chinese camera chips inside the world's cars? — 2026-10-22
- How China took control of the chips that power electric cars — 2026-10-22
- Can advanced packaging let China skip the EUV bottleneck? — 2026-10-22
- YMTC (长江存储) ships 294-layer NAND and licenses its hybrid-bonding patents to Samsung — 2026-10-21
- Inside SMIC's N+2 line — Huawei's AI chips built at ~30% yield, with EUV off the table — 2026-10-21
- The 2025 EDA blackout lasted five weeks — and accelerated China's chip-design software push — 2026-10-21
- CXMT (长鑫存储) races to HBM mass production — three years behind, one AI boom ahead — 2026-10-21
- China's largest chip-equipment maker shows what self-reliance costs — 2026-10-20
- China's assisted-driving chip supplier crosses ten million shipments — 2026-10-20
- China's homegrown chip-design software is closing its longest gaps — 2026-10-20
- China's advanced-packaging upstart is turning chiplets into its main business — 2026-10-20
- China's photoresist gap: why 95% of advanced chip 'ink' still comes from Japan — 2026-10-19
- China's mature-node land grab: from 30% to 39% of global capacity by 2027 — 2026-10-19
- China's gallium nitride bet: how a Suzhou firm became the world's top GaN power-chip maker — 2026-10-19
- China's auto-chip push: how a 2021 shortage became a 25% local-content mandate — 2026-10-19